Method and apparatus for forming clasp envelopes

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5186705
SERIAL NO

07806251

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An approved method and apparatus for forming clasp envelopes. The apertures extending through the top and bottom panels of the envelope body and the clasp receiving aperture extending through the top flap are formed after the envelope has been completely assembled save for the folding of the top flap for shipping. This ensures that the apertures extending through the top and bottom panels of the envelope body are in perfect registration. Reinforcement tape is applied on the top flap of the envelope, through which the aperture in the top flap extends, after the envelopes have been cut from the continuous strip of envelope blanks. This ensures that the cutting device used to sever the continuous strip into individual envelopes must cut only paper, thus improving longevity of the cutting device, and allows a single punch device to be used to form the hole and the apertures. Additionally, the method and apparatus employ an improved device for applying the clasp to the back panel of the envelope body. This clasp attaching device includes a resilient anvil which is adjustable to vary the prong insertion depth and is completely removable to allow test runs without the application of the clasps.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
WINKLER & DUNNEBIER A CORP OF GERMANYPOSTFACH 2340 D-5450 NEUWIED 1

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Doderer-Winkler, Alfred Melsbach, DE 3 160

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