Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals
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United States of America Patent
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Feb 23, 1993
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app pub date -
Dec 23, 1991
filing date -
Apr 28, 1989
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Abstract
A technique for producing a chip mount type package or a TAB package with high reliability, without use of a flux which would cause environmental pollution or would hinder an enhancement of reliability, more particularly pertains to a method of irradiating bonding surfaces, for which a solder is used, and solder bump electrodes of a package with an atomic or ion energy beam, and bonding the bonding surfaces to each other under normal pressure (about 1 atm) in a continuous apparatus.
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