Extremely tough thermosetting bismaleimide resin systems
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United States of America Patent
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Feb 23, 1993
Issued Date -
N/A
app pub date -
Sep 27, 1989
filing date -
Feb 17, 1989
priority date (Note) -
Expired
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Abstract
Bismaleimide resin systems containing low viscosity epoxy resins and a swellable or soluble thermoplastic when utilized to impregnate intermediate modulus carbon fiber are capable of preparing quasiisotropic composites, which, when cured, exhibit compression strengths after impact of greater than 47-50 ksi after an impact of 1500 in-lb/in.
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