Wafer slicing and grinding machine and a method of slicing and grinding wafers
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Mar 2, 1993
Grant Date -
N/A
app pub date -
Aug 30, 1990
filing date -
Aug 30, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A wafer slicing and grinding machine is provided with a saw blade assembly for the slicing of wafers from an ingot. A grinding stage is also provided for sequentially grinding the rear face of a previously sliced wafer and the front face of an ingot in order to provide a double ground wafer. A transfer chuck and a holding chuck are disposed within the machine to perform movements for effecting a turning over of a wafer for grinding of the rear face of the wafer.
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