High density memory array packaging
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United States of America Patent
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-
Mar 2, 1993
Issued Date -
N/A
app pub date -
Sep 30, 1991
filing date -
Dec 20, 1989
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A low-profile, high-density package for intergrated circuit chips is provided. A first multichip memory module includes first and second interconnect members having low-profile memory chips mounted on a first side of each member. Low-profile edge clips are employed to mechanically connect a second side of the second member to a second side of the first member, and to electrically connect the first sides of the members to a first surface of a circuit board. Likewise, a second multichip memory module includes first and second interconnect members having low-profile memory chips mounted to a first side of each member. Low-profile edge clips are employed to mechanically connect the second sides of the members, and to electrically connect the first sides of the members to a second surface of the circuit board. A thermal management technique that distributes thermal loads is thereafter applied to create a high-density package capable of insertion into a standard computer backplane and cabinet.
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