Wire bonding method
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United States of America Patent
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Mar 9, 1993
Grant Date -
N/A
app pub date -
Feb 27, 1992
filing date -
Feb 27, 1991
priority date (Note) -
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Abstract
In a wire bonding method in which a capillary is raised from a first bonding point after bonding and then moved in a direction opposite to a second bonding point, thus making a reverse action, such a reverse action is made in a circular-arc shape around a neck part of the wire at the first bonding point. Thus, an ideal wire-looping is accomplished, thus preventing wire damage which could be caused by reverse actions.
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