Low cost erasable programmable read only memory package
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United States of America Patent
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-
Mar 9, 1993
Issued Date -
N/A
app pub date -
Apr 14, 1992
filing date -
Aug 31, 1990
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor device and package includes a tape mounted semiconductor chip using bumped contacts, the top side of the chip is covered with a thin layer of ultra violet transmissive material, and a plastic removable frame surrounds the device and is removed after testing the device and prior to mounting the device on a printed circuit board.
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