Method of making a extended integration semiconductor structure
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United States of America Patent
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Mar 9, 1993
Issued Date -
N/A
app pub date -
Jul 24, 1991
filing date -
Jan 25, 1989
priority date (Note) -
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Abstract
A low cost, lightweight, fast, dense and reliable extended integration semiconductor structure is provided by forming a thin film multilayer wiring decal on a support substrate and aligning and attaching one or more integrated chips to the decal. A support ring is attached to the decal surrounding the aligned and attached integrated substrate, and the support substrate is removed. Reach-through vias connect the decal wiring to the chips.
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