Methods and apparatus for soldering without using flux
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United States of America Patent
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Mar 16, 1993
Grant Date -
N/A
app pub date -
Sep 18, 1992
filing date -
Sep 18, 1992
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Metallic surfaces are soldered together without using flux or solvents. The metallic surfaces are maintained in an atmosphere of inert gas and cleaned with a laser. An ejection device deposits drops of liquid solder on a predetermined one of the metallic surfaces and the metallic surfaces are moved relative to each other so that the solidified solder contacts the other metallic surface. The metallic surfaces and the solidified solder are then heated until the solidified solder reflows and joins the metallic surfaces.
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