Removal of excimer laser debris using carbon dioxide laser
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 16, 1993
Grant Date -
N/A
app pub date -
Oct 17, 1991
filing date -
Oct 17, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Disclosed is a method of fabricating a microelectronic circuit package. The circuit package has a reinforced fluorocarbon polymer dielectric. According to the disclosed process, vias or through holes are formed in the composite by a process that leaves debris. The debris in the formed vias or through holes is reflowed in order to smooth the via and through hole walls for subsequent plating.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully