Process for manufacturing thermal ink jet printheads having metal substrates and printheads manufactured thereby
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United States of America Patent
Stats
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Mar 16, 1993
Grant Date -
N/A
app pub date -
May 24, 1991
filing date -
May 24, 1991
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method of manufacturing a thermal ink jet printhead wherein a reusable mandrel consisting of either a metal pattern on an insulating or semiconductive substrate or an insulating pattern on a metal substrate or metal layer is used in the process of electroforming a plurality of metal substrates used for starting a batch fabrication process. Next, thin film layers of insulating, resistive, and conductive materials are formed on the surfaces of the metal substrates to thereby define heater resistors and lead-in conductors for the plurality of thermal ink jet printheads being formed. Then, a barrier layer such as Vacrel is photodefined on the surface of the thin film insulating, resistive, and conductive layers to thereby define a plurality of ink drop ejection chambers surrounding each of the previously formed heater resistors. Next, a plurality of orifice plates are secured, respectively, to the barrier layers in each of the printheads being formed. Finally, the plurality of metal substrates may be removed from the mandrel, such as by stripping away, without the requirement for substrate dicing, and an appropriate mask on the mandrel may be used to create an ink feed hole in each of the metal substrates. The metal substrates are further provided with a break tab line during the electroforming process which is aligned with break patterns in both the above thin film layers and orifice plates. In this manner, the individual thin film printheads may be easily broken away and separated one from another.
First Claim
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
| Patent Owner | Address | |
|---|---|---|
| HEWLETT-PACKARD COMPANY | PALO ALTO CA |
International Classification(s)
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- [Patents Count]
Inventor(s)
| Inventor Name | Address | # of filed Patents | Total Citations |
|---|---|---|---|
| Lam, Si-Ty | Pleasanton, CA | 34 | 912 |
| Taub, Howard H | San Jose, CA | 14 | 842 |
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| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|
| Fee | Large entity fee | small entity fee | micro entity fee |
|---|---|---|---|
| Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
| Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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