Dielectric composition and solder interconnection structure for its use
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United States of America Patent
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Mar 16, 1993
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N/A
app pub date -
Sep 16, 1991
filing date -
Sep 16, 1991
priority date (Note) -
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Abstract
Composition and solder interconnection structure for its use, wherein the gap created by solder connections between a carrier substrate and a semiconductor chip device mounted thereon is filled with the solvent free formulation obtained by curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof, polyol, and filler which is substantially free of alpha particle emissions.
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