Method of manufacturing a printed circuit board
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United States of America Patent
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-
Mar 23, 1993
Issued Date -
N/A
app pub date -
Feb 24, 1992
filing date -
Jul 20, 1990
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A method of manufacturing a printed circuit board comprises the steps of providing an insulating substrate for the printed circuit board, forming circuit patterns made of a conductive material on at least one side of the insulating substrate, forming an insulating layer on the circuit patterns, and adhering a cross-mesh shield layer onto at least a portion of the insulating layer in such a manner that a margin is placed both on the outer periphery of the insulating layer itself and around electric contacts such as lands and through-holes.
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