US Patent No: 5,196,089

Number of patents in Portfolio can not be more than 2000

Multilayer ceramic substrate for mounting of semiconductor device

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Abstract

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In a method of fabricating a multilayered interconnection for integrated circuit package, a coating of a metallized conductive pattern is formed on an upper surface of the substrate. A plurality of vertical copper studs are formed on the substrate for an interconnection with the metallized conductive pattern. A polyimide slurry is provided on the surface of the substrate to cover each top surface of the conductive studs. An upper surface of the polyimide slurry is polished to expose each top surface of the copper studs. A masking film is provided on each top surface of the copper studs prior to supplying an intermediate derivative of a polyimide polymer. The masking film works to protect the intermediate derivative against an chemically reaction with the copper studs to avoid a chelate compound from being produced at the time of heating step followed; A coat of the intermediate derivative of the polyimide polymer is provided entirely on the polished surface of the polyimide slurry, and is heated to form a coating of a polyimide layer. Then the coating of the polyimide layer is partly removed to expose portions corresponding to each top surface of the copper studs. The masking film is removed by etching.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
NGK SPARK PLUG CO., LTD.AICHI1800

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Imai, Ryuji Aichi, JP 12 236
Kambe, Rokuro Nagoya, JP 13 152
Takada, Toshikatsu Aichi, JP 21 96

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (2)
4,622,058 Formation of a multi-layer glass-metallized structure formed on and interconnected to multi-layered-metallized ceramic substrate 53 1986
4,970,106 Thin film multilayer laminate interconnection board 31 1990

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (2)
6,022,485 Method for controlled removal of material from a solid surface 2 1997
6,254,719 Method for controlled removal of material from a solid surface 0 1999
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (2)
5,640,051 Chip package, a chip carrier, a terminal electrode for a circuit substrate and a chip package-mounted complex 41 1994
5,628,919 Methods for producing a chip carrier and terminal electrode for a circuit substrate 17 1995
 
DONGBU HITEK CO., LTD. (1)
8,048,802 Method for forming interlayer insulating film in semiconductor device 0 2008
 
HARRIS CORPORATION (1)
6,184,463 Integrated circuit package for flip chip 82 1998
 
Other [Check patent profile for assignment information] (1)
5,432,999 Integrated circuit lamination process 100 1994

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