Flip chip bonding method using electrically conductive polymer bumps
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United States of America Patent
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-
Mar 23, 1993
Issued Date -
N/A
app pub date -
Aug 16, 1991
filing date -
Dec 18, 1989
priority date (Note) -
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Abstract
A method is presented for interconnecting bond pads of a flip chip with bond pads of a substrate by an electrically conductive polymer. A first organic protective layer is selectively formed over a surface of a flip chip to thereby leave exposed bond pads on the flip chip. An electrically conductive polymerizable precursor is disposed on the bond pads extending to a level beyond the organic protective layer. The first and second layers are polymerized to form electrically conductive bumps. A second organic protective layer is then formed on the surface of the substrate around the substrate bond pads, leaving the substrate bond pads exposed. An electrically conductive adhesive is then disposed on the substrate bond pads. The bumps are aligned with bond pads of a substrate and then contacted to those bond pads. The adhesive is polymerized to form electrical interconnections between the flip chip bond pads and the substrate bond pads.
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