Integrated circuit package with molded cell
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United States of America Patent
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-
Mar 23, 1993
Issued Date -
N/A
app pub date -
Dec 3, 1991
filing date -
Jan 26, 1990
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An integrated circuit package encapsulates a volatile memory chip and a backup battery for preserving data in the event of loss of main power supply. The package includes a lead frame assembly encapsulated within a body of non-conductive material, with the memory chip being mounted onto a base plate on one side of the lead frame. The battery is supported in offset relation by axial power leads on the opposite side of the lead frame. The integrated circuit chip, the battery, the lead frame assembly and the gold interconnect wires are completely encapsulated within the molded package body.
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