Method of forming recloseable packages, profiles used therein, and packages produced thereby
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United States of America Patent
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Mar 30, 1993
Issued Date -
N/A
app pub date -
Nov 8, 1991
filing date -
Apr 24, 1989
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of forming a recloseable package using special profile strips, the strips themselves and a resulting package are disclosed. The profile strips have a flange element and a recloseable means element, and two mated profile strips are provided with a heat barrier means. The method comprises the steps of providing mated top and bottom profile strips, providing top and bottom package films on opposite sides of the mated strips and applying heat and pressure to the films adjacent the flanges sufficient to simultaneously form heat seals respectively between the top film and the top profile strip flange and between the bottom film and bottom profile strip flange. The heat barrier means may comprise a thickened flange element, buffer strip or a coextrusion of high temperature resin on the inside layer of the flange element. The heat barrier means prevents the flanges from fusing together during the formation of flange-film seals.
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