Integrated circuit test fixture and method
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United States of America Patent
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-
Mar 30, 1993
Grant Date -
N/A
app pub date -
Jun 29, 1990
filing date -
Jun 29, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A test fixture (10) for integrated circuits includes a wafer chuck (12). The chuck (12) has a plurality of concentrically arranged vacuum hold down rings (14) which communicate with top (18) of the chuck (12). Between the hold down rings (14) are a plurality of concentrically arranged helium gas supply rings (20), connected to a source of helium gas (22), and also communicating with top (18) of the chuck (12). An integrated circuit wafer (24) is mounted on the top (18) of the chuck (12), held in place by the vacuum hold down rings (14). Helium has a thermal conductivity five times that of air. Flow of helium gas in the helium supply rings (20) between the wafer (24) and the chuck (12) therefore reduces the interface thermal resistance between the wafer (24) and the chuck (12) as much as five times. A coolant supply tube (32) extends through the probe card (26), terminating proximate to the wafer (24), and is connected to a source of coolant (33), to assist the cooling.
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