Method for inspecting printed circuit boards with through-holes
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 30, 1993
Grant Date -
N/A
app pub date -
Apr 9, 1991
filing date -
Apr 16, 1990
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method for inspecting a printed circuit board having through-holes filled with conductive paste and having a pair of current measurement lands and a pair of resistance measurement lands. The pairs of current measurement lands and resistance measurement lands are used to measure voltage and current through the through-holes using the four-probe method, thereby preventing incomplete inspection of printed circuit boards and improving the dependability of tests on the packing conditions of the conductive paste in the through-holes.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully