
US Patent No: 5,198,824
Number of patents in Portfolio can not be more than 2000
High temperature co-fired ceramic integrated phased array packaging
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Mar 30, 1993
Issued date -
Jan 17, 1992
filing date -
07/822,392
serial no -
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Abstract
A phased array package using a cofired ceramic material system to integrate antenna elements and an hermetic multi-chip MMIC cavity into a single module to provide incorporation of microwave circuit geometries into a system which has been used in the prior art only for low frequency applications. The integration provides a package very similar to a conventional integrated circuit package with substantial cost reductions over the complicated microwave assemblies of the present art.
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International Classification(s)
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Cited Art
| Patent Info | (Count) | # Cites | Year |
|---|---|---|---|
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| 4,771,294 Modular interface for monolithic millimeter wave antenna array | 31 | 1986 | |
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| 4,899,118 Low temperature cofired ceramic packages for microwave and millimeter wave gallium arsenide integrated circuits | 43 | 1988 | |