Free form packaging of specific functions within a computer system
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United States of America Patent
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-
Mar 30, 1993
Grant Date -
N/A
app pub date -
Dec 18, 1991
filing date -
Dec 18, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method and apparatus is provided for allowing computer functions formed on a flexible substrate to be adjacently stacked in layered relation. Each functional island will have an electrical connector on one end thereof. The electrical connector may include a plurality of conductive pads formed over solid vias that form a surface for electrically interconnecting adjacent flexible carriers of the functional islands. The solid vias and connection pads are also used to provide electrical communication between the reference plane, signal lines and chips that make up the functional islands, and chips contained on other functional islands, or on the planar. The plural functional islands are removably affixed to the planar by reflowing joining metallurgy on the connection pads of adjacent layers, or by using a compression type connector. The remaining portions of the functional islands are then flexibly placed within the computer system with varying amounts of space between the layers.
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