System for achieving desired bondlength of adhesive between a semiconductor chip package and a heatsink
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United States of America Patent
Stats
-
Apr 6, 1993
Issued Date -
N/A
app pub date -
Sep 26, 1991
filing date -
May 14, 1990
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Spacers are attached to or made an integral part of the housing of a semiconductor package in order to set a desired spacing between a surface of the package housing and the heatsink. Then when the heatsink is attached to the housing, a uniform clearance is maintained between the heatsink and the surface of the housing. When such clearance is filled with an epoxy for bonding the heatsink to the housing, the bondlength of the epoxy layer will be uniform and be of the desired value.
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