Exposed die-attach heatsink package
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United States of America Patent
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Apr 6, 1993
Grant Date -
N/A
app pub date -
Sep 27, 1991
filing date -
Sep 27, 1991
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A technique for packaging an integrated-circuit die in a conventional molded-plastic package exposes the lead frame to which the integrated-circuit die is attached so that heat-conducting columns can be directly attached to the leadframe through vias formed in the molded plastic package. The vias expose selected areas of the lead-frame to which are attached the thermally conductive columns, which extend to an exterior surface of the molded plastic package so that the lead-frame and the conductive columns provide a path for conduction of heat from the die to the exterior of the package.
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