Method for removing photoresist and other adherent materials from substrates
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United States of America Patent
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Apr 13, 1993
Issued Date -
N/A
app pub date -
Feb 26, 1992
filing date -
Feb 4, 1991
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for removing adherent matrices, such as highly cross-linked photoresist layers, from substrates, such as semiconductor wafers, comprises exposing the matrix to a vapor phase solvent and allowing the solvent to penetrate the matrix. After penetration, the vapor is condensed and then revaporized in order to promote fragmentation of the matrix and facilitate removal. Optionally, the matrix may be treated with a pre-swelling solvent and the resulting fragments removed by washing with a liquid or vapor solvent for the fragmented matrix material.
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