Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders
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United States of America Patent
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Apr 20, 1993
Grant Date -
N/A
app pub date -
Aug 12, 1991
filing date -
Aug 12, 1991
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of bonding a flexible circuitized substrate to a circuitized substrate (e.g., printed circuit board) to interconnect selected circuitry of both substrates using solder. Solder paste is applied over conductive pads on the circuitized substrate and organic dewetting material (e.g., epoxy coating) adjacent thereto. The flexible substrate, having conductors located within and/or traversing an aperture in the flexible substrate's dielectric, is positioned above the solder paste and heat is applied (e.g., in an oven). The paste, dewetting from the organic material, 'balls up' and substantially surrounds a solder member (ball) attached to a bridging portion of the flexible substrate's conductor, thereby connecting both substrates. A frame member may be used to align the flexible substrate, both during solder member attachment thereto, as well as for aligning the flexible substrate having solder members attached, to the respective solder paste locations on the lower substrate.
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