Method of checking external shape of solder portion
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United States of America Patent
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Apr 27, 1993
Grant Date -
N/A
app pub date -
Dec 7, 1990
filing date -
Dec 13, 1989
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The upper-limit height of a solder portion based on the thickness of a lead or a chip is set, and the maximum height of the solder portion measured with a laser beam is compared with the set upper-limit height, thereby to judge the acceptance or rejection of the shape of the solder portion. In addition, the lower-limit height of a solder portion based on the thickness of a lead or a chip is set, and the maximum height of the solder portion measured with a laser beam is compared with the set lower-limit height, thereby to judge the acceptance or rejection of the shape of the solder portion. Besides, the lower-limit wetting angle of a solder fillet is set, and the wetting angle of the solder fillet measured with a laser beam is compared with the set lower-limit wetting angle, thereby to judge the acceptance or rejection of the shape of the solder fillet.
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