IC card and a method for the manufacture of the same
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United States of America Patent
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-
May 4, 1993
Issued Date -
N/A
app pub date -
Oct 16, 1991
filing date -
Apr 20, 1988
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
In an IC card of the invention, an IC module (3) is adhered to a first concave (9) of a card base (1) by means of an adhesive (7) and a gap (8) is formed between the outside surface of the IC module (3) and the inside surface of the first concave (9), the gap being wider in the inside upper part and narrower in the inside lower part of the first concave (9), so that the IC chip in the IC module (3) and the card base (1) can be protected from damages caused by bending of the the card base (1).
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