Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid
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United States of America Patent
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May 11, 1993
Issued Date -
N/A
app pub date -
Aug 27, 1992
filing date -
Jul 3, 1989
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A hermetic semiconductor package having a ceramic lid with the device leads extending vertically through the lid is disclosed. The leads are mechanically retained within the apertures in the lid and direct bonded to the lid to provide a hermetic seal and a substantial lead density.
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