Lead grid array integrated circuit
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United States of America Patent
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-
May 18, 1993
Grant Date -
N/A
app pub date -
Apr 17, 1992
filing date -
Apr 17, 1992
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method for attaching an array of flexible leads to the bottom of an integrated circuit package. There is provided a sheet of electrically conductive material. A plurality of slots are punched into the sheet, such that there is formed a plurality of beams. The beams are then bent into a spring shape. The sheet is placed over an integrated circuit package which has an array of contact pads extending across a bottom surface of the package. The beams are aligned and attached to the contact pads. The beams are then cut and separated from the remainder of the sheet. The sheet is removed, wherein there is constructed an integrated circuit package that has a two dimensional array of flexible leads.
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