Method of producing a printed circuit board
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United States of America Patent
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-
May 18, 1993
Grant Date -
N/A
app pub date -
Jul 22, 1991
filing date -
Jul 24, 1990
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of manufacturing a printed circuit board comprises providing an insulating substrate having opposed major sides, forming a through-hole between the two sides of the insulating substrate, forming a conductive land on both sides of the insulating substrate surrounding the ends of the through-hole, forming margining frames at the outer peripheries of the conductive lands, and packing conductive paste into the through-hole after the formation of the margining frames. The margining frames extend vertically beyond the height of the conductive lands and prevent the conductive paste from spreading outwardly beyond the outer peripheries of the conductive lands.
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