Capacitive pressure sensor and method of manufacturing the same
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United States of America Patent
Stats
-
May 18, 1993
Grant Date -
N/A
app pub date -
Oct 4, 1991
filing date -
Oct 5, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
According to a capacitive pressure sensor and a method of manufacturing the same, first and second grooves are formed in one and the other surfaces of a substrate, respectively. A sacrificial layer is embedded in the first groove. Insulating films are formed on the substrate, on which the sacrificial layer is formed, to sandwich an electrode. Etching is performed to form a pressure introducing hole through the substrate to reach the sacrificial layer. A hollow portion is formed by removing the sacrificial layer through the pressure introducing hole.
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