Moulding compound based on thermosetting resin material
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United States of America Patent
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May 18, 1993
Issued Date -
N/A
app pub date -
Apr 23, 1991
filing date -
Apr 11, 1985
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention relates to a moulding compound based on thermosetting resin material and optionally fibers, fillers, curing catalysts and further usual additives, and is characterized in that the moulding compound comprises a mixture of at least two thermosetting resins of which a first resin is in a partly cured state, and of which a second resin is not, or less than the first resin in a partly cured state.
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