Lead frame for semiconductor devices having improved adhesive bond line control
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United States of America Patent
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-
May 25, 1993
Grant Date -
N/A
app pub date -
Jul 8, 1991
filing date -
Jul 8, 1991
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Described is a lead frame design which allows for greater control of adhesive thickness which bonds the die with the die paddle on the lead frame. A number of bumps on the surface of the lead frame contact the die, thereby keeping the die a controlled distance from the surface of the die paddle. A sufficient amount of adhesive is applied to the die paddle to ensure a minimum allowable contact of the die with the adhesive, and the adhesive with the lead frame. Enough force is applied to the surface of the die to allow contact between the die and the bumps on the surface of the inventive lead frame. The force applied to the surface of the die, therefore, has no effect on the thickness of the bond line, as long as some minimum amount of pressure is applied.
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