Substrate for packaging a semiconductor device
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United States of America Patent
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-
May 25, 1993
Grant Date -
N/A
app pub date -
Jan 23, 1991
filing date -
Jan 23, 1990
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A substrate for packaging a semiconductor device having a bump thereon according to the present invention is characterized by that the substrate has an electrode terminal to which the bump is to be connected, and a recess for receiving at least a top of the bump is formed in the electrode terminal.
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