Thermally reactive lead assembly and method for making same
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United States of America Patent
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May 25, 1993
Grant Date -
N/A
app pub date -
Dec 31, 1991
filing date -
Dec 31, 1991
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Thermally reactive lead assemblies and electronic circuits are provided which include a solderable, conductive metallic element having a first configuration at ambient temperature and a second expanded configuration at an elevated temperature, such as at soldering temperatures. The second configuration of the conductive metallic element provides electrical continuity between a pair of soldering locations of the electronic circuit, such as between a semiconductor device lead and a conductive surface on a printed circuit board.
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