High density grid array socket

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5215472
SERIAL NO

07748505

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A leadless component socket comprises a one- or two-piece leadless component contact socket assembly having a plurality of holes with a respective plurality of spring contacts disposed therein. The socket assembly includes a finger slot or slots to facilitate the manual removal of a chip carrier from the socket and a bias clip and integral keyed corner for assuring proper alignment of the chip carrier with the contacts of the socket assembly. The socket further comprises a cover, a cover support, an insulator assembly and a backup plate or other fastening means for supporting the socket on a printed circuit board. The socket assembly can be configured with a variety of contact terminal ends adapted for a desired mode of circuit board interface. A variety of cover configurations are also accommodated and disclosed.

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Patent Owner(s)

Patent OwnerAddress
THOMAS & BETTS INTERNATIONAL INC501 SILVERSIDE ROAD SUITE 67 WILMINGTON DE 19809

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Corbesero, Steven R Johnston, RI 1 76
DelPrete, Stephen D Rehoboth, MA 14 363
Santos, Don Rehoboth, MA 1 76

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