Polishing pad conditioning apparatus for wafer planarization process
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United States of America Patent
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Jun 8, 1993
Grant Date -
N/A
app pub date -
Sep 24, 1992
filing date -
Sep 24, 1992
priority date (Note) -
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Abstract
An improved apparatus for polishing a thin film formed on a semiconductor substrate includes a rotatable table covered with a polishing pad. The table and the pad are then rotated relative to the substrate which is pressed down against the pad surface during the polishing process. Means is provided for generating a plurality of grooves in the pad while substrates are being polished. The continually formed grooves help to facilitate the polishing process by channeling slurry between the substrate and the pad.
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