Semiconductor bonding tool
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jun 8, 1993
Issued Date -
N/A
app pub date -
May 22, 1990
filing date -
Jun 13, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The disclosure relates to a bonding tool tip bonding electronic interconnects having a shank portion formed of a relatively hard, stiff material having a high modulus of elasticity and a foot portion formed of polycrystalline diamond bonded to the shank portion. The shank portion is preferably formed of tungsten carbide. The foot portion can have an aperture therethrough for feeding of wire to be welded.
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Cited Art Landscape
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