Method for aligning wafers within a semiconductor wafer cassette
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United States of America Patent
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-
Jun 8, 1993
Issued Date -
N/A
app pub date -
Feb 10, 1992
filing date -
Aug 18, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An improvement which allows precise positioning of wafers within cassettes in preparation for removal of the wafers by automated equipment. The improvement includes mounting two sawtooth jigs upon the surface upon which the cassette tray is to be placed which extend up into the cassette. Wafers within the cassette rest within the precisely aligned grooves of the sawtooth jigs. When the cassette is placed upon the surface, automated equipment can readily remove the precisely aligned wafers from the cassette.
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