Solder bump transfer method
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United States of America Patent
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-
Jun 8, 1993
Grant Date -
N/A
app pub date -
Apr 1, 1991
filing date -
Apr 1, 1991
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method for forming a plurality of solder bumps on an electronic component substrate utilizes a transfer plate to electrodeposit solder deposits and subsequently reflow the deposits onto the substrate. The plate comprises discrete pad electrodes formed of a ceramic material that is suitably electrically conductive to permit electroplating of the solder alloy, but is not wet by the molten solder to permit reflow onto the substrate. A preferred electrode material is an indium oxide compound. The solder deposits are plated onto the electrodes, and the transfer plate is superposed on the substrate such that the bumps rest upon bond pads on the substrate. The assembly is heated and cooled to melt and resolidify the solder alloy, whereupon the solder bonds to the substrate pads to form the bumps.
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