Bonding of polyimide film
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United States of America Patent
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Jun 8, 1993
Grant Date -
N/A
app pub date -
Nov 8, 1991
filing date -
Nov 8, 1991
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Disclosed is a method for electroplating a metal sheet adapted for being used in electronic packaging material, such as printed circuit boards. Bismaleimide and its derivative are added into the plated solution so as to form insoluble particles of bismaleimide and its derivatives on the surface of the metal sheet. The resulting metal sheet is particularly adapted for being bonded to a polyimide film for the preparation of, for example, a printed circuit board. Also disclosed is a method of bonding the metal sheet of the present invention to a polyimide substrate. Precursor of polyimide are coated on the surface of the plate metal sheet and then thermal imidizing of the precursors takes place. No additional adhesives are needed for this bonding.
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