Adhesiveless susceptor films and packaging structures
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United States of America Patent
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Jun 8, 1993
Grant Date -
N/A
app pub date -
Sep 5, 1991
filing date -
Sep 5, 1991
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A susceptor composite and related packaging devices employing the susceptor composite comprising a plurality of heat sealable layers is disclosed. The susceptor composite is adhesiveless and is used in food packages for heating and cooking food products in a microwave oven. In one preferred embodiment, a first substrate of amorphous polyester has a metallic microwave absorptive layer deposited on one of its surfaces. A dimensionally stable layer that includes a heat sealable material is heat sealed to at least one of the first substrate and microwave absorptive layer. The heat sealable film can be applied in a pattern and can also be applied using different heat-sealing temperatures to provide selective microwave absorption to the susceptor composite of the invention.
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