Method of making a transfer molded semiconductor device
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United States of America Patent
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Jun 15, 1993
Grant Date -
N/A
app pub date -
Mar 18, 1991
filing date -
Mar 18, 1991
priority date (Note) -
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status (Latency Note)
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Abstract
A method of making a pad array chip carrier package is disclosed. A semiconductor device (10) is bonded to a ceramic substrate (12). The semiconductor device may be attached to the substrate by wirebonding, tab bonding or flip chip bonding. The bonded assembly (16) is then attached to a flexible temporary support substrate (18) by means of an adhesive (19). The entire assembly is then placed into a mold cavity (20 and 22) and registered against the temporary support substrate (18). Plastic material (30) is molded about the semiconductor device and associated wirebonds in order to encapsulate the device. After removal from the mold, the encapsulated assembly is removed from the temporary support substrate (18) by peeling the temporary support substrate (18) from the circuit substrate.
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