Process for manufacturing printed wiring boards
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United States of America Patent
Stats
-
Jun 15, 1993
Grant Date -
N/A
app pub date -
Apr 8, 1992
filing date -
Apr 8, 1991
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A laminated board in which each of prepreg sheets is sandwiched between an internal printed wiring board which is provided with wirings and each of external printed wiring board which is provided with wirings on the outermost surface thereof is formed with through-holes by drilling. A thin copper plating layer is formed on the surfaces of the laminated board including the inner wall of the through-hole. Then, an alkali-soluble photoresist film is selectively formed on the surface of the thin copper plating layer and a thick copper plating layer is formed. The thin copper plating layer is removed by using the thick copper plating layer as a mask to forme through holes and wirings. The through holes and wirings can be thus formed without using the additive process. Environmental pollution due to use of organic solvents can be prevented by avoiding the use of an organic solvent-soluble resist film having a strong resistance to alkalis.
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