High temperature co-fired ceramic integrated phased array package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 15, 1993
Issued Date -
N/A
app pub date -
Aug 10, 1992
filing date -
Jan 17, 1992
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A phased array package using a cofired ceramic material system to integrate antenna elements and an hermetic multi-chip MMIC cavity into a single module to provide incorporation of microwave circuit geometries into a system which has been used in the prior art only for low frequency applications. The integration provides a package very similar to a conventional integrated circuit package with substantial cost reductions over the complicated microwave assemblies of the present art.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully