Solid state imaging apparatus in which a solid state imaging device chip and substrate are face-bonded with each other
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United States of America Patent
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Jun 15, 1993
Grant Date -
N/A
app pub date -
Apr 29, 1991
filing date -
Aug 27, 1990
priority date (Note) -
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Abstract
A solid state imaging apparatus which can be made small in the contour is formed of a solid state imaging device chip provided with pad electrodes formed near a photoelectrically converting part, an interal connecting substrate bent so that a plurality of surfaces not on the same plane as this solid state imaging device chip may be formed and face-bonded and connected with the pad electrodes of this solid state imaging device chip through bumping members and electronic parts fitted on this connecting substrate and functionally connected to the solid state imaging device chip.
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