Importance

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Abstract

Pillars are formed on a substrate at the same time as electrical circuit components are formed thereon and of the same materials used to form the circuit, the pillars serving to maintain standoff of an integrated circuit chip during bonding of solder bumps on the chip underside to the formed substrate circuit. The pillars are provided without extra materials and steps, under the existing alignment requirements for providing the circuit components, during the applying of a series of discontinuous layers, e.g., by screen printing, onto the substrate to form the circuit, by also applying portions of the series of layers as stacked layers in spaced island areas to form the pillars at otherwise unused substrate sites.

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First Claim