Tape-automated bonding of integrated circuits
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United States of America Patent
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-
Jun 29, 1993
Issued Date -
N/A
app pub date -
Oct 15, 1991
filing date -
Jul 17, 1981
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A tape for use in tape-automated-bonding of integrated circuits is disclosed. A series of interconnection arrays ('frames') are arranged along the tape, each array being formed by a number of interconnection beams 3. A terminal ('bump') 6 is located on each beam 3 for bonding to a respective interconnection pad 7 of an integrated circuit 8. Conventional bumps are made of gold-plated copper and have uneven and unyielding bonding surfaces which can fail to provide consistent bonds. The bumps 6 of the tape disclosed comprise a conductive material having a Vickers hardness number of 55 or less, and thus have a compliance which facilitates more even bonding. A method of producing the tape is also disclosed.
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