Plastic molded semiconductor device having waterproof cap
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 29, 1993
Grant Date -
N/A
app pub date -
Sep 13, 1990
filing date -
Sep 14, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A plastic molded semiconductor device having a semiconductor chip mounted on a die pad supported by hanging pins. The semiconductor chip is encapsulated by mold plastic where the semiconductor chip has a lead portion protruding to a side, and in which practically the entire periphery of the semiconductor chip is covered by aluminum or some other moistureproof material that stops the entry of moisture.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully