Foldable electronic assembly module
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 29, 1993
Grant Date -
N/A
app pub date -
Feb 10, 1992
filing date -
Feb 10, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electronic assembly combines a number of commensurate printed circuit boards bonded to a common, flexible, interconnecting substrate in an alternately folded and layered arrangement against an end board that has a comb of terminals for mounting into a motherboard connector. The flexible substrate is sandwiched between half-sections of each board, allowing mounting of components from both faces of the board. The assembly is particularly indicated for high density applications such as memory modules.
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International Classification(s)
- Non-US Classification not provided for expired patents
Cited Art Landscape
Patent Citation Ranking
- Citation Ranking not provided for expired patents
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